The SAINKO single-sided grinding and polishing machine is designed for processing small batches of both metallic and non-metallic materials, as well as for precision parts requiring high flatness and high levels of surface finish.

It is also suitable for research, development and laboratory testing applications.

It can be used in rough grinding, heavy polishing, fine polishing and other finishing processes, combined with synthetic copper plates and different polishing pads.

Scope:

Suitable for processing mechanical seals, automotive components, stainless steel accessories for mobile phones, molds for light guide plates, oil pumps, valve bodies and other precision technical parts.

Field of application: Suitable for the rapid grinding and polishing of parts made of stainless steel, copper, aluminum and metal alloys, such as suitcase fittings, high-end accessories, mobile phone components and similar products.

Fully enclosed single-sided grinding and polishing machine

The fully enclosed SAINKO single-sided grinding and polishing machine allows for the configuration of different pressure application systems, including manual drive, pneumatic systems with lifting cylinder and cylinder-controlled pressure, adapting to different work needs.

Especially suitable for high-precision applications requiring high levels of cleanliness, such as research, semiconductors, mechanical seals, automotive and other advanced industrial sectors.

Field of application: Suitable for bags, hardware, high-end accessories, mobile phone accessories and other products made of stainless steel, copper and aluminum.

Single-sided grinding and polishing machine with cylinder pressure

The SAINKO single-sided cylinder pressure grinding and polishing machine incorporates a low friction coefficient cylinder controlled by an SMC electric proportional valve, which allows automatic adjustment of the working pressure through the program.

Optionally, the motor's drive shaft can power each working axis, ensuring uniform friction during the process. This is an ultra-precision machine designed for single-sided machining of parts by rotating the grinding wheel, supplying process fluid, and applying controlled pressure to the workpiece.

The grinding plate can be optionally equipped with a water cooling system, preventing deformations caused by temperature changes during the process.

Combined with resin abrasive discs and different polishing pads, the machine allows for both intensive grinding and polishing processes as well as fine finishing operations.

Scope:

Suitable for processing sapphire wafers, ceramic substrates, mechanical seals, zirconia ceramics and other high-precision technical parts.